Patent Sales

Learn More ›

Lot W120622-V - Temperature Control Hardware

Lot Description:

The patents in this lot generally relate to specialized electronic components. In particular, the patents in this lot pertain to systems, methods, apparatus, and devices related to dissipation/transfer of operating heat among electronic components (e.g. integrated circuits) in electronic devices.



Exemplary Patent(s):

Patent US6118655 generally teaches systems and methods for dissipation of operating heat in electronic devices. Specifically, US6118655 pertains to apparatus and methods for an improved heat pipe-based forced air cooling system for electronic devices such as computers.



Patent Lot Citation(s):

This lot is forward referenced by the following companies: Aavid Laboratories, Inc., Alcatel Lucent, AST Research, Inc., Astronautics Corporation of America, ASUSTek Computer Inc., Cool Options, Inc., Corning Incorporated, Cray Research, Inc., Dell Products L.P., Delta Electronics, Inc., Fanuc, Ltd., Fujitsu Limited, Gibson Guitar Corp., Hitachi, Ltd., Hon Hai Precision Industry Co., Ltd., Honeywell International Inc., Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Intel Corporation, International Business Machines Corporation, Inventec Corporation, Kabushiki Kaisha Sato, Matsushita Electric Industrial Co., Ltd., Micron Technology, Inc., NCR Corporation, Nexabit Networks, Inc., Nikon Corporation, Northern Telecom Limited, PFU Limited, Stratus Computer, Inc., Sun Microsystems, Inc., Tatung Co., Ltd., Thermacore, Inc., Wistron NeWeb Corp.



Relevant Industry Segments:

IC packaging



Number of Patents: 10 US

Make Offer ›
Download Lot


Patents:

US5946189
PIVOTABLE SUPPORT AND HEAT SINK APPARATUS REMOVABLY CONNECTABLE WITHOUT TOOLS TO A COMPUTER PROCESSOR

Granted Date: 08/31/1999
Filing Date: 10/05/1998

US6075696
PORTABLE COMPUTER WITH FLEXIBLE HEAT SPREADER PLATE STRUCTURE THEREIN

Granted Date: 06/13/2000
Filing Date: 11/06/1997

US6109343
Low EMI Emissions Heat Sink Device

Granted Date: 08/29/2000
Filing Date: 02/03/2000

US6118655
COOLING FAN WITH HEAT PIPE-DEFINED FAN HOUSING PORTION

Granted Date: 09/12/2000
Filing Date: 12/08/1997

US6163454
ELECTROMAGNETIC INTERFERENCE (EMI) SHIELD FOR ELECTRICAL COMPONENTS, AN INTERNAL EMI BARRIER, AND A STORAGE ENCLOSURE FOR ELECTRICAL/ELECTRONIC COMPONENTS

Granted Date: 12/19/2000
Filing Date: 02/22/1999

US6167949
Low EMI Emissions Heat Sink Device

Granted Date: 01/02/2001
Filing Date: 02/03/2000

US6167955
Multi-Mode Heat Transfer Using A Thermal Heat Pipe Valve

Granted Date: 01/02/2001
Filing Date: 10/26/1999

US6244953
Electronic Device Fan Mounting System

Granted Date: 06/12/2001
Filing Date: 05/25/1999

US7019244
ELECTROSTATIC PRECIPITATOR

Granted Date: 03/28/2006
Filing Date: 04/20/2002

US7926552
Jacket For Heat Dispersion Device

Granted Date: 04/19/2011
Filing Date: 10/19/2007



» Back to Lots


If you have specific patent sales needs that you think HP can help you with, we invite you to contact the patent sales team.


» View all industry segments

Quick Links

View all industry segments

How can we help?

Meet our team of licensing professionals.

Resources

Exemplary offer letter

PDF Preview

Opens Lot PDF