PRODUCTS AND SOLUTIONS

The Campus of the Future is powered by technology that improves productivity and collaboration, while minimizing costs and security risks. HP products are designed for innovation and affordability.

ELITE PCs

Give your campus an edge with the world’s most secure and manageable PCs.1 Experience cutting-edge design, innovative engineering, and high-quality materials with sophisticated and durable HP Elite PCs.

HP Z WORKSTATIONS

Whether preparing for a career in Engineering, Sciences or the Arts, HP Z Workstations are built to provide students the best performance and experience to prepare them for the professions of tomorrow.

BRING CUTTING-EDGE TECHNOLOGY TO YOUR HIGHER-ED CLASSROOMS

REALITY WILL NEVER BE THE SAME AGAIN

Experience working in a whole new world using HP VR Ready PCs and HP Sprout Pro to create immersive instruction, art, and research.

SCALE YOUR PRINT ENVIRONMENT AS YOUR CAMPUS EVOLVES

Let HP help you implement solutions to better predict costs, increase uptime, and enhance security at your institution.

THIN CLIENTS

Secure technology for powerful and collaborative learning.

CREATE BREAKTHROUGH EXPERIENCES FOR YOUR STUDENTS

From VR to eSports, ensure your students are engaged and contributing to your campus academic and social communities.

1. Based on HP’s unique and comprehensive security capabilities at no additional cost and HP Manageability Integration Kit’s management of every aspect of a PC including hardware, BIOS and software management using Microsoft System Center Configuration Manager among vendors with >1M unit annual sales as of September 2017, on HP Elite PCs with 7th Gen Intel® Core® Processors, Intel® integrated graphics, and Intel® WLAN.

2. World’s thinnest and lightest business convertible claim based on business convertibles, with Windows Pro OS as of September 1, 2017.

3. Based on HP’s internal testing of ultra slim 14” business notebooks as of September 1, 2017.

4. Based on desktop workstations as of June 14, 2017 and power based on processor, graphics, memory, and power supply.

5. Based on detachables of vendors as of October 3, 2017. Power based on processor, graphics and memory.

6. Based on internal testing, HP Jet Fusion 3D printing solution average printing time is up to 10 times faster than average printing time of comparable FDM & SLS printer solutions from $100,000 USD to $300,000 USD on market as of April 2016. Testing variables: Part Quantity: 1 full build chamber of parts from HP Jet Fusion 3D at 20% of packing density versus same number of parts on above-mentioned competitive devices; Part size: 30 g; Layer thickness: 0.1mm/0.004 inches. Fast cooling module available in 2017 with some models will further accelerate production time.

7. Based on internal testing and public data, HP Jet Fusion 3D average printing cost per part is half the average cost of comparable FDM & SLS printer solutions from $100,000 USD to $300,000 USD on market as of April 2016. Cost analysis based on: standard solution configuration price, supplies price, and maintenance costs recommended by manufacturer. Cost criteria: printing 1 build chamber per day/ 5 days per week over 1 year of 30-gram parts at 10% packing density using HP 3D High Reusability PA 12 material, and the powder reusability ratio recommended by manufacturer.

8. Data courtesy of EBK-Hungary Kft.

9. Data courtesy of Clemson University.

12. Based on commercial desktop PCs as of January 10, 2017 among vendors with >1 million unit annual sales having 7th Gen Intel® processors or AMD Pro processors, Windows Pro OS, GTX1080 or AMD RX480 graphics card and 500W power supply.

13. Based on commercial desktop PCs as of January 10, 2017 among vendors with >1 million unit annual sales having 5 bays, 4 slots, 12 USB, two M.2 connectors and Windows Pro OS.

14. "Most secure printers" claim applies to HP Enterprise-class devices introduced beginning in 2015 and is based on HP review of 2016 published embedded security features of competitive in-class printers. Only HP offers a combination of security features for integrity checking down to the BIOS with self-healing capabilities. A FutureSmart service pack update may be required to activate security features. For a list of compatible products, visit: http://h20195.www2.hp.com/V2/GetDocument.aspx?docname=4AA6-1178ENW (PDF, 126KB). For more information: hp.com/go/printersecurityclaims.

15. Based on HP assessment of print manufacturers’ SaaS offerings as of September 1, 2016, no other print manufacturer offers a single cloud portal for user and app management.

16. Based on HP’s unique and comprehensive security capabilities at no additional cost among vendors on HP Elite PCs with Windows and 8th Gen and higher Intel® processors or AMD Ryzen™ 4000; HP ProDesk 600 G6 with Intel® 10th Gen and higher processors.

17. Select household wipes can be safely used to clean HP Elite and Workstation PCs up to 1,000 wipes: See wipe manufacturer’s instructions for disinfecting and the HP cleaning guide for HP tested wipe solutions at How to Sanitize Your HP Device Whitepaper (http://h20195.www2.hp.com/v2/GetDocument.aspx?docname=4AA7-7610ENW) Not applicable to HP Elite c1030 Chromebook.

18. See user guide for cleaning instructions. Select household wipes can be safely used to clean HP Elite and Workstation PCs up to 1,000 wipes: See wipe manufacturer’s instructions for disinfecting and the HP cleaning guide for HP tested wipe solutions at How to Sanitize Your HP Device Whitepaper (http://h20195.www2.hp.com/v2/GetDocument.aspx?docname=4AA7-7610ENW) Not applicable to HP Elite c1030 Chromebook.

Intel and Core are trademarks of Intel Corporation or its subsidiaries in the U.S and/or other countries.

© Copyright 2017 HP Development Company, L.P. The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein.